Hello, welcome to SAFE Circuits Technology Co.,Ltd

Chinese English にほんこ

Service hotline:


+86 0755 27055569 +86 18938919530

News
Product center
Contact us

Tel:0755-27055569

Fax:0755-27066835

E-mail:gnpcb@gnpcba.com

Your current position:Home > NewsFAQ

There are holes in the hole, copper particles in the wall, and copper wire.

date:2018-04-09

   

If there are holes in the copper process, copper particles in the hole wall and copper wire, what is the problem with the potions? What is SAP process?

The general definition of a copper, refers to the rubber slag, the chemical copper, the whole plate electroplating the three processes as a whole. Holes in the wall of the hole, copper particles and copper wire, these problems are often not a copper problem, but the chemical copper precipitation or the removal of the slag process. In the process of degumming, the circuit board will be processed by the three potion agents, such as leavening agent, oxidant and reducing agent. If the water aged in the reduction process, the permanganate residue may be removed from the pore wall. This kind of circuit board when entering the chemical copper, can produce local micro etching liquid medicine attacks and loss, this time by the agent set up of the active layer will be damaged and cause bad hole breaking chemical copper growth.

Chemical copper itself, of course, also may produce hole problems, such as: chemical copper activity insufficiency, the depth of the hole is too high chemical copper treatment, use whole hole agent and colloid palladium has a problem, which will affect the quality of hole wall. If the drilling quality is poor, the holes are more likely to occur, especially if the holes in the wall are too thick, which can lead to the cleaning of the defects and the influence of the residual liquid on the chemical copper precipitation.

题,特别容易让孔破发生。至于发生铜颗粒、铜丝等电镀问题,比较常见到的问题来源以刷磨不良、化学铜粗糙等因素较常见。在改善化学铜方面,改善水洗、剥挂架完整性及药液置换量等都是可行办法,其中尤其要避免让化学铜微蚀与剥挂架处理槽混用,这类问题常在代工与工作场地受限的工厂发生。当两者混用时,剥挂架处理残留的胶体会析出在孔内,而产生孔壁粗糙现象。从这个角度看,要排除这类粗糙问题,不但应该避免槽体混用,还应注意钯胶体及水洗过滤循环系统,唯有这样才能让孔壁粗糙机会降到最低。 
     业者也可以在产品允许状况下考虑使用直接电镀制程,这类制程没有钯胶体问题,不过某些系统商因为电路板结构与过去历史经验问题而限制这类技术使用,这是设立制程时要先考虑的部分。黑影(Shadow)、黑孔(BlackHole)等制程,都是这类技术的代表作,或许也有改善孔壁铜颗粒问题的功能。 
      SAP全称是「SemiAdditiveProcess」,因为一般线路制作分为全蚀刻和部分蚀刻部分线路电镀两种作法。部分蚀刻这种作法,其线路制作能力较强,可以制作较细线路。因此一般电路板外部线路,如果其线路设计较细时,就可能考虑采用SAP制程制作线路。近年来线路制作要求愈来愈精密,因此部分线路板制作采用全化学铜为基础的做法,而目前业界多数称所谓的SAP制程就是专指此类做法。 
    其实凡有线路电镀制作的方法都应该可以称为SAP制程,只是它们的底铜厚度有差异而已,不过目前业者比较认为只有底铜纯为化学铜的制程才该用这样的称呼。另外在构装载板领域,业者也部分采用超薄铜皮制作线路,此时又增加了一种不同称谓「M-SAP」,这个M指的是Metal,就是铜金属的意思,此时制程不再是纯化学铜基础,而是超薄铜皮。以上仅供参考。 

一铜制程如果发生孔破、孔壁有铜颗


Type: NewsFAQ

1
Online customer service
close

service hotline

+86 0755 27055569

 
serve